SM320VC5510A-HIREL Datasheet, PDF (48/81 Pages) Texas Instruments – SM320VC5510A-HiRel Fixed-Point Digital Signal Processor

Electrical Specifications
Tester Pin Electronics
42 W
4.0 pF
3.5 nH
1.85 pF
Transmission Line
Z0 = 50 W
(see note)
Data Sheet Timing Reference Point
Output
Under
Test
Device Pin
(see note)
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.
The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from
the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 5−1. Test Load Circuit
5.5 Package Thermal Resistance Characteristics
Table 5−1 provides the thermal resistance characteristics for the recommended package types used on the
SM320VC5510AZPH DSP.
Table 5−1. Thermal Resistance Characteristics (Ambient)
R_ΘJA (°C / W)
73.32
BOARD TYPE^†
JEDEC 2s Type PCB (Low-k)
AIRFLOW (LFM)
0
63.44
JEDEC 2s Type PCB (Low-k)
150
57.10
JEDEC 2s Type PCB (Low-k)
250
† _{Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal}
Measurements.
Table 5−2. Thermal Resistance Characteristics (Case)
R_ΘJC (°C / W)
BOARD TYPE^†
13.25
2s JEDEC Test Card
† _{Board types are as defined by JEDEC. Reference JEDEC Standard JESD51-9, Test Boards for Area Array Surface Mount Package Thermal}
Measurements.
48 SPRS672
April 2010