TPA6166A2 Datasheet, PDF (42/49 Pages) Texas Instruments – 3.5-mm Jack Detect and Headset Interface IC

TPA6166A2
SLAS997B – MARCH 2014 – REVISED JANUARY 2015
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10.2 Layout Example
10.2.1 Pad Sizing
When determining the pad size for the WCSP terminals, use nonsolder mask defined (NSMD) land. With this
method, the solder mask opening is made larger than the desired land area, and the opening size is defined by
the copper pad width. Figure 35 and Table 8 show the appropriate diameters for a WCSP layout.
Copper Trace Width
Solder Mask Thickness
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Figure 35. Land Pattern Dimensions
M0200-01
SOLDER PAD
DEFINITION
Nonsolder mask
defined (NSMD)
Table 8. Land Pattern Dimensions ^(1)(2)(3)(4)
COPPER PAD
SOLDER MASK⁽⁵⁾
OPENING
COPPER
THICKNESS
STENCIL^{(6) (7)}
OPENING
230 μm
310 μm
1 oz. max. (32 μm)
275 μm × 275 μm sq.
(rounded corners)
STENCIL
THICKNESS
100 μm thick
(1) Circuit traces from NSMD-defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device standoff and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating range of the intended
application.
(3) Recommended solder paste is type 3 or type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5) Solder mask thickness should be less than 20 µm on top of the copper circuit pattern.
(6) Best solder stencil performance is achieved using laser-cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Table 9. Package Dimensions
D
Max. = 2470 µm
Typ. = 2440 µm
Min. = 2410 µm
E
Max. = 2470 µm
Typ. = 2440 µm
Min. = 2410 µm
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