TPS62231-Q1_16 Datasheet, PDF (4/25 Pages) Texas Instruments – 3-MHz Ultra-Small Step-Down Converter

TPS62231-Q1, TPS622314-Q1
SLVSB63A – DECEMBER 2011 – REVISED MARCH 2016
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6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
Machine Model (MM)
VALUE
±2000
±1000
200
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
operating ambient temperature T_A = –40 to 105°C (unless otherwise noted)⁽¹⁾
Supply voltage, V_IN(2)
Effective output inductance
Effective output capacitance
Recommended minimum
supply voltage
V_OUT ≤ (V_IN – 1 V)⁽³⁾
V_OUT ≤ 1.8 V
Operating junction temperature, T_J
Ambient temperature, T_A
500-mA maximum I_OUT(4)
350-mA maximum I_OUT(4)
60-mA maximum output current⁽⁴⁾
MIN NOM MAX UNIT
2.05
6V
0.7
1 or
2.2
4.3 μH
2 4.7
15 μF
3 3.6
2.5 2.7 V
2.05
–40
125 °C
–40
105 °C
(1) In applications where high power dissipation, poor package thermal resistance, or both are present, the maximum ambient temperature
may have to be derated. Maximum ambient temperature (T_A(max)) is dependent on the maximum operating junction temperature
(T_J(max)), the maximum power dissipation of the device in the application (P_D(max)), and the junction-to-ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A(max) = T_J(max) – (R_θJA × P_D(max)).
(2) The minimum required supply voltage for start-up is 2.05 V. The device is functional down to the falling UVLO (undervoltage lockout)
threshold.
(3) For a voltage difference between minimum V_IN and V_OUT of ≥ 1 V
(4) Typical value applies for T_A = 25°C, maximum value applies for T_A = 105°C with T_J ≤ 125°C, PCB layout needs to support proper
thermal performance.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS62231x-Q1
DRY (SON)
UNIT
6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
294.5
166.5
166.1
27.3
159.9
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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