TPS62090_14 Datasheet, PDF (4/29 Pages) Texas Instruments – 3A High Efficient Synchronous Step Down Converter with DCS™ Control

TPS62090, TPS62091, TPS62092, TPS62093
SLVSAW2B – MARCH 2012 – REVISED APRIL 2014
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7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Voltage range
PVIN, AVIN, FB, SS, EN, FREQ, VOS⁽²⁾
SW, PG
Power Good sink current
PG
Continuous total power dissipation
Operating junction temperature range, T_J
VALUE
MIN
MAX
UNIT
–0.3
7
V
–0.3
V_IN+0.3
V
1
mA
See the Thermal Table
–40
150
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
7.2 Handling Ratings
T_stg
Storage temperature range
V_(ESD)
Electrostatic discharge
Human body model (HBM) per ANSI/ESDA/JEDEC
JS-001, all pins ⁽¹⁾
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins ⁽²⁾
MIN
–65
–2
–500
MAX
150
2
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
kV
V
7.3 Recommended Operating Conditions⁽¹⁾
V_IN
Input voltage range V_IN
T_A
Operating ambient temperature
T_J
Operating junction temperature
(1) See the application section for further information
MIN
TYP
MAX UNIT
2.5
6
V
–40
85
°C
–40
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPS6209x
QFN (16 PINS)
UNIT
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
47
60
20
°C/W
1.5
20
5.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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