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TMP302A-Q1 Datasheet, PDF (4/18 Pages) Texas Instruments – TMP302x-Q1, Automotive Grade, Low-Power, Easy-to-Use
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TMP302A-Q1, TMP302B-Q1, TMP302C-Q1, TMP302D-Q1
SLOS889A – OCTOBER 2014 – REVISED NOVEMBER 2014
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage
Input pin voltage
Output pin voltage
Output pin current
Operating temperature
Junction temperature range
TRIPSET0, TRIPSET1, HYSTSET
OUT
OUT
MIN
MAX
UNIT
3.6
V
–0.5
VS + 0.5
V
–0.5
3.6
V
10
mA
–55
130
°C
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
Tstg
Storage temperature range
–60
Human body model (HBM), per AEC Q100-002(1)
–2
V(ESD) Electrostatic discharge
Charged device model (CDM), per AEC Q100-011
–1
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
MAX
150
2
1
UNIT
°C
kV
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS
Rpullup
Power supply voltage
Pullup resistor connected from OUT to VS
MIN
NOM
MAX UNIT
1.4
3.3
3.6
V
10
100
kΩ
7.4 Thermal Information
THERMAL METRIC(1)
DRL
6 PINS
UNIT
RθJA
RθJC(top)
RθJB
ψJT
ψJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
200
73.7
34.4
°C/W
3.1
34.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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