TLV62090_16 Datasheet, PDF (4/27 Pages) Texas Instruments – 3A High Efficiency Synchronous Step-Down Converter

TLV62090
SLVSBB9E – MARCH 2012 – REVISED JANUARY 2016
5 Pin Configuration and Functions
RGT Package
16-Pin VQFN
Top View
SW
SW
DEF
PG
16 15 14 13
1
12
2 Exposed 11
Thermal Pad
3
10
45 _{6 7 8} 9
PVIN
PVIN
AVIN
SS
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PIN
NAME
NO.
SW
1, 2
DEF
3
PG
4
FB
5
AGND
6
CP
7
CN
8
SS
9
AVIN
PVIN
10
11,12
EN
13
PGND
14,15
VOS
16
Exposed Thermal
Pad
Pin Functions
I/O
DESCRIPTION
I/O Switch pin of the power stage.
I This pin is used for internal logic and needs to be pulled high. This pin should not be left floating.
Power good open drain output. This pin is high impedance if the output voltage is within regulation. This pin is
O pulled low if the output is below its nominal value. The pull up resistor can not be connected to any voltage
higher than the input voltage of the device.
I Feedback pin of the device. Connect a resistor divider to set the output voltage.
Analog ground.
I/O Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
I/O Internal charge pump flying capacitor. Connect a 10 nF capacitor between CP and CN.
I
Softstart control pin. A capacitor is connected to this pin and sets the softstart time. Leaving this pin floating
sets the minimum start-up time.
I Bias supply input voltage pin.
I Power supply input voltage pin.
I
Device enable. To enable the device this pin needs to be pulled high. Pulling this pin low disables the device.
This pin has a pull down resistor of typically 400 kΩ, which is active when EN is low.
Power ground connection.
I Output voltage sense pin. This pin needs to be connected to the output voltage.
The exposed thermal pad is connected to AGND. It must be soldered for mechanical reliability.
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