TLV3501A-Q1_15 Datasheet, PDF (4/22 Pages) Texas Instruments – Rail-to-Rail, High-Speed Comparator in Microsize Packages

TLV3501A-Q1
SBOS533B – SEPTEMBER 2010 – REVISED OCTOBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Signal input terminal voltage⁽²⁾
Signal input terminal current⁽²⁾
Output short-circuit current⁽³⁾
Thermal impedance, junction to free air
Operating temperature
Junction temperature
Storage temperature
MIN
(V−) − 0.3
–40
–65
MAX
5.5
(V+) + 0.3
10
74
200
125
150
150
UNIT
V
V
mA
mA
°C/W
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short circuit to ground, one comparator per package.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
All pins
Corner pins (1, 3, 4, and 6)
VALUE
±2000
±500
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage
V_IL
Low-level input voltage, SHDN (comparator is enabled)⁽¹⁾
V_IH
High-level input voltage, SHDN (comparator is disabled)⁽¹⁾
T_A
Operating temperature
MIN
2.2
(V+) – 0.9
–40
NOM
2.7
MAX
5.5
(V+) – 1.7
125
UNIT
V
V
V
°C
(1) When the SHDN pin is within 0.9 V of the most positive supply, the part is disabled. When it is more than 1.7 V below the most positive
supply, the part is enabled.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLV3501A-Q1
DBV (SOT-23)
UNIT
6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
192.2
134.8
37.1
28.3
36.7
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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