TLC555-Q1 Datasheet, PDF (4/25 Pages) Texas Instruments – LinCMOS™ TIMER

TLC555-Q1
SLFS078B – OCTOBER 2006 – REVISED OCTOBER 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_DD
Supply voltage⁽²⁾
V_I
Input voltage
Sink current, discharge or output
I_O
Source current, output
Continuous total power dissipation
T_A
Operating free-air temperature
T_stg
Storage temperature
Any input
MIN
MAX
18
–0.3
V_DD
150
15
See Dissipation
Ratings
–40
125
–65
150
UNIT
V
V
mA
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network GND.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC
Q100-011
All pins
Corner pins (1, 4, 5, and
8)
VALUE
±1000
±500
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
V_DD
Supply voltage
T_A
Operating free-air temperature
MIN
MAX UNIT
2
15 V
–40
125 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC555-Q1
D (SOIC)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
113.7
58
54.5
11.1
53.9
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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