TLC27M4ACDR Datasheet, PDF (4/50 Pages) Texas Instruments – LinCMOS PRECISION QUAD OPERATIONAL AMPLIFIERS

TLC27M4, TLC27M4A, TLC27M4B, TLC27M4Y, TLC27M9
SLOS093D – OCTOBER 1987 – REVISED OCTOBER 2012
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TLC27M4Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC27M4C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(13)
(12) (11) (10)
(9)
68
(1)
(2)
(3) ₍₄₎ (5)
(6)
108
V_DD
(8)
(4)
(3)
1IN +
+
(1)
(2)
1OUT
1IN–
–
2OUT
3IN +
3IN–
(7)
(10)
+
(9)
–
+ ⁽⁵⁾
(6)
–
(8)
2IN +
2IN–
3OUT
(14)
4OUT
+ ⁽¹²⁾
(13)
–
4IN +
4IN–
(11)
(7)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 ´ 4 MINIMUM
T_Jmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
4
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