TL971 Datasheet, PDF (4/33 Pages) Texas Instruments – OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS

TL971, TL972, TL974
SLOS467H – OCTOBER 2006 – REVISED JANUARY 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC Supply voltage range
V_ID
Differential input voltage⁽²⁾
V_IN
Input voltage range⁽³⁾
T_J
Maximum junction temperature
T_stg Storage temperature range
MIN
2.7
V_CC– – 0.3
–65
MAX
15
±1 V
V_CC+ + 0.3
150
150
UNIT
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages for the noninverting input terminal are with respect to the inverting input terminal.
(3) The input and output voltages must never exceed V_CC + 0.3 V.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
2000
1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
V_CC
V_ICM
T_A
Supply voltage
Common-mode input voltage
Operating free-air temperature
MIN
2.7
V_CC– + 1.15
–40
MAX
12
V_CC+ – 1.15
125
UNIT
V
V
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TL971
TL972
D ⁽²⁾
DBV ⁽²⁾
D ⁽²⁾
DGK ⁽³⁾ DRG⁽³⁾
P ⁽²⁾
8 PINS 5 PINS
8 PINS
R_θJA
Package
thermal
impedance,
97
206
97
172
44
85
junction to
free air
PW ⁽²⁾
149
TL974
D ⁽²⁾
N ⁽²⁾
PW⁽²⁾ UNIT
14 PINS
86
80
113 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
(2) Package thermal impedance is calculated in accordance with JESD 51-7.
(3) Package thermal impedance is calculated in accordance with JESD 51-5.
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