TL1431-EP_15 Datasheet, PDF (4/23 Pages) Texas Instruments – TL1431-EP Precision-Programmable Reference

TL1431-EP
SLVS529D – APRIL 2004 – REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Cathode voltage⁽²⁾, V_KA
Continuous cathode current, I_KA
Reference input current, I_I(ref)
Operating virtual junction temperature⁽³⁾, T_J
Lead temperature 1.6 mm (1/16 inch) from case for 10 s
Storage temperature, T_stg
MIN
–100
–0.00005
–65
MAX
37
150
10
150
260
150
UNIT
V
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ANODE, unless otherwise noted.
(3) Long-term high-temperature storage and/or use at the absolute maximum ratings may result in a reduction of overall device life. See
www.ti.com/ep_quality for additional information on enhanced plastic packaging.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±4000
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
V_KA
Cathode voltage
I_KA
Cathode current
T_A
Operating free-air temperature
MIN
V_I(ref)
1
–55
MAX
36
100
125
UNIT
V
mA
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TL1431-EP
D
UNIT
8 PINS
R_θJA(high)
R_θJA(low)
Junction-to-ambient thermal resistance (high K board)
Junction-to-ambient thermal resistance (low K board)
97
°C/W
165
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Dissipation Rating Table
PACKAGE
T_A ≤ 25°C
POWER RATING
PACKAGE
THERMAL
IMPEDANCE
97°C/W (High K
board)
D
1102 mW
165°C/W (Low K
board)
DERATING
FACTOR
ABOVE T_A =
25°C
10 mW/°C
T_A = 70°C
ABSOLUTE
MAXIMUM
POWER RATING
T_A = 85°C
ABSOLUTE
MAXIMUM
POWER RATING
T_A = 125°C
ABSOLUTE
MAXIMUM
POWER RATING
824 mW
670 mW
257 mW
6 mW/°C
484 mW
393 mW
151 mW
4
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