THS4521-HT Datasheet, PDF (4/28 Pages) Texas Instruments – VERY LOW POWER, NEGATIVE RAIL INPUT, RAIL-TO-RAIL OUTPUT, FULLY DIFFERENTIAL AMPLIFIER

THS4521-HT
SBOS548D – APRIL 2011 – REVISED MAY 2012
www.ti.com
T_A
–55°C to175°C
–55°C to 210°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
D
THS4521HD
KGD (bare die)
THS4521SKGD1
HKJ
THS4521SHKJ
HKQ
THS4521SHKQ
TOP-SIDE MARKING
THS4521
NA
THS4521SHKJ
THS4521SHKQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range (unless otherwise noted).
Supply Voltage, V_S– to V_S+
Input/Output Voltage, V_I (V_IN±, V_OUT±, V_OCM pins)
Differential Input Voltage, V_ID
Output Current, I_O
Input Current, I_I (V_IN±, V_OCM pins)
Continuous Power Dissipation
Maximum Junction Temperature, T_J (continuous operation, long-term reliability)⁽²⁾
Operating Free-air Temperature Range, T_A
D package
KGD, HKJ, HKQ packages
Storage Temperature Range, T_STG
ESD
Rating:
Human Body Model (HBM)
Charge Device Model (CDM)
Machine Model (MM)
UNIT
3.6
V
(V_S–) – 0.7 to (V_S+) + 0.7V
V
1
V
100
mA
10
mA
See Thermal Characteristic Specifications
217
°C
–40 to 175
°C
–55 to 210
–65 to 210
°C
1300
V
1000
V
50
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
(2) Refer to Figure 1 for expected life time.
THERMAL CHARACTERISTICS FOR D PACKAGE
over operating free-air temperature range (unless otherwise noted)
θ_JC ⁽¹⁾
θ_JA
PARAMETER
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
(1) Taken as per JESD51.
MIN
TYP
MAX UNIT
72.5 °C/W
118.5 °C/W
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
to ceramic side of case
θ_JC
Junction-to-case thermal resistance
to top of case lid (metal side of case)
MIN
TYP
MAX UNIT
5.7
°C/W
13.7
4
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