TCA9800 Datasheet, PDF (4/36 Pages) Texas Instruments – Level-Translating I2C Bus Buffer/Repeater

TCA9800
SCPS264 – MARCH 2017
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CCA
V_CCB
V_EN
V_I/O
I_OL
I_IK
I_OK
Operating junction
temperature
Storage temperature
Supply voltage on A-side
Supply voltage on B-side
Enable input voltage
I²C bus voltage
Maximum SDAA, SCLA I_OL current
Input clamp current (SDAB/SCLB)
Input clamp current (EN, VCCA, VCCB, SDAA, SCLA)
Output clamp current (SDAB/SCLB)
Output clamp current (EN, VCCA, VCCB, SDAA, SCLA)
T_J
T_stg
MIN
MAX
UNIT
–0.5
4
V
–0.5
4
V
–0.5
4
V
–0.5
4
V
20
mA
–20
mA
–20
mA
–20
mA
–20
mA
130
°C
–60
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-
001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
T_A
V_CCA
V_CCB
V_I/O
Operating free-air temperature
Supply voltage
Supply voltage
SDAA, SCLA
Input-output voltage
SDAB, SCLB
EN
MIN
MAX
UNIT
–40
125
°C
0.8
3.6
V
1.65
3.6
V
0
3.6
0
3.6
V
0
3.6
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TCA9800
DGK (VSSOP)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
Ψ_JT
Ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
174.1
85
104.4
18.3
102.8
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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