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| SN75LVPE801 Datasheet, PDF (4/34 Pages) Texas Instruments – 8.0 Gbps SATA Express Equalizer and Redriver | |||
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SN75LVPE801
SLLSEW8 â SEPTEMBER 2016
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage, VCC(2)
Voltage
Storage temperature, Tstg
Differential I/O
Control I/O
MIN
MAX
UNIT
â0.5
4
V
â0.5
4
V
â0.5
VCC + 0.5
â65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground pin.
7.2 ESD Ratings
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
VALUE
±6000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
typical values for all parameters are at VCC = 3.3 V and TA = 25°C; all temperature limits are specified by design
MIN
TYP
MAX
VCC
Supply voltage
Coupling capacitor
3
3.3
3.6
75
100
200
TA
Operating free-air temperature
0
85
UNIT
V
nF
°C
7.4 Thermal Information
THERMAL METRIC(1)
SN75LVPE801
DRF (WSON)
UNIT
8 PINS
RθJA
RθJCtop
RθJB
ÏJT
ÏJB
RθJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
97.8
°C/W
81.9
°C/W
65.6
°C/W
1.3
°C/W
65.6
°C/W
19.1
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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