SN65LBC175A-EP Datasheet, PDF (4/21 Pages) Texas Instruments – Quadruple RS-485 Differential Line Receiver

SN65LBC175A-EP
SLLSEU5 – DECEMBER 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
MIN
Supply voltage, V_CC(2)
–0.3
Voltage at any bus input (steady state), A and B
–10
Voltage at any bus (transient pulse through 100 Ω, see Figure 10)
–30
Input voltage at 1,2EN and 3,4EN, V_I
–0.5
Receiver output current, I_O
–10
Storage temperature, T_stg
–65
MAX
6
15
30
V_CC + 0.5
10
150
UNIT
V
V
V
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to GND and are steady-state (unless otherwise specified).
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification
JESD22-C101 ⁽²⁾
A and B to GND
All pins
All pins
VALUE
±6000
±5000
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_CC
Supply voltage
Voltage at any bus terminal
A, B
V_IH
High-level input voltage
EN
V_IL
Low-level input voltage
Output current
Y
T_J
Junction temperature
MIN NOM MAX UNIT
4.75
5 5.25 V
–7
12 V
2
V_CC V
0
0.8 V
–8
8 mA
–55
125 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
SN65LBC175A-EP
D (SOIC)
UNITS
16 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
78
°C/W
39.5
°C/W
35.4
°C/W
8.5
°C/W
35.1
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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