OPA365-Q1_16 Datasheet, PDF (4/22 Pages) Texas Instruments – Single-Supply Operational Amplifiers

OPA365-Q1, OPA2365-Q1
SBOS512D – MARCH 2010 – REVISED DECEMBER 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC
Supply voltage
V_I
Signal input terminals, voltage⁽²⁾
I_I
Signal input terminals, current⁽²⁾
t_OSC
Output short-circuit duration⁽³⁾
T_OP
Operating temperature
T_J
Junction temperature
T_stg
Storage temperature
MIN
MAX
5.5
(V−) − 0.5 (V+) + 0.5
–10
10
Continuous
–40
150
150
–65
150
UNIT
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage V– to V+
T_A
Operating free-air temperature
MIN
NOM
MAX UNIT
2.2
3.3
5.5
V
–40
25
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA2365-Q1
D (SOIC)
OPA365-Q1
DBV (SOT-23)
UNIT
8 PINS
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
115.5
60.1
56.9
9.5
56.3
208.8
123.7
54.6
37.2
36.3
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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