OPA2836-Q1 Datasheet, PDF (4/44 Pages) Texas Instruments – Very-Low Power, Rail-to-Rail Out, Negative-Rail In, Voltage-Feedback Operational Amplifier

OPA2836-Q1
SBOS794 – DECEMBER 2016
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_S– to V_S+
V_I
V_ID
I_I
I_O
T_J
T_A
T_stg
Supply voltage
Input voltage
Differential input voltage
Continuous input current
Continuous output current
Continuous power dissipation
Maximum junction temperature
Operating free-air temperature
Storage temperature
MIN
MAX
5.5
V_S– – 0.7
V_S+ + 0.7
1
0.85
60
See Thermal Information
150
–40
125
–65
150
UNIT
V
V
V
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Human body model (HBM), per AEC Q100-002⁽¹⁾
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
VALUE
±6000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S+
Single supply voltage
T_A
Ambient temperature
MIN
NOM
MAX UNIT
2.5
5
5.5
V
–40
25
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA2836-Q1
DGK (VSSOP)
UNIT
8 PINS
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
177.7
69.3
98.8
11.7
97.2
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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