OPA2171-EP_16 Datasheet, PDF (4/28 Pages) Texas Instruments – 36-V, Single-Supply, SOT553, General-Purpose Operational Amplifiers

OPA2171-EP
SBOS735 – SEPTEMBER 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range, unless otherwise noted⁽¹⁾
Supply voltage
Signal input pins
Output short circuit⁽²⁾
Junction temperature
Storage temperature, T_stg
Voltage
Current
MIN
MAX
±20
(V–) – 0.5 (V+) + 0.5
–10
10
Continuous
150
–65
150
UNIT
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±4000
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+ – V–)
Operating temperature, T_J
MIN
4.5 (±2.25)
–55
NOM
MAX
36 (±18)
125
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA2171-EP
DCU (VSSOP)
8 PINS
175.2
74.9
22.2
1.6
22.8
N/A
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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