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OPA171_11 Datasheet, PDF (4/30 Pages) Texas Instruments – 36V, Single-Supply, SOT553, General-Purpose OPERATIONAL AMPLIFIERS
OPA171
OPA2171
OPA4171
SBOS516C – SEPTEMBER 2010 – REVISED JUNE 2011
www.ti.com
THERMAL INFORMATION: OPA171
THERMAL METRIC(1)
θJA
θJC(top)
θJB
ψJT
ψJB
θJC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
8 PINS
149.5
97.9
87.7
35.5
89.5
N/A
OPA171
DBV (SOT23)
5 PINS
245.8
133.9
83.6
18.2
83.1
N/A
DRL (SOT553)
5 PINS
208.1
0.1
42.4
0.5
42.2
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2171
THERMAL METRIC(1)
θJA
θJC(top)
θJB
ψJT
ψJB
θJC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
8 PINS
134.3
72.1
60.6
18.2
53.8
N/A
OPA2171
DCU (VSSOP)
8 PINS
175.2
74.9
22.2
1.6
22.8
N/A
DGK (MSOP)
8 PINS
195.3
59.4
115.1
4.7
114.4
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4171
THERMAL METRIC(1)
θJA
θJC(top)
θJB
ψJT
ψJB
θJC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
14 PINS
93.2
51.8
49.4
13.5
42.2
N/A
OPA4171
PW (TSSOP)
14 PINS
106.9
24.4
59.3
0.6
54.3
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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