LMP91200_16 Datasheet, PDF (4/24 Pages) Texas Instruments – Configurable AFE for Low-Power Chemical-Sensing Applications

LMP91200
SNAS571E – JANUARY 2012 – REVISED FEBRUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)
Supply Voltage (V_S = VDD – GND)
Voltage between any two pins
Current out at any pin
Junction Temperature⁽⁴⁾
Storage Temperature, T_stg
MIN
MAX
UNIT
–0.3
6
V
–0.3
VDD + 0.3
V
5
mA
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering specifications see product folder at www.ti.com and SNOA549.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) The maximum power dissipation is a function of T_J(MAX), R_θJA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/R_θJA. All numbers apply for packages soldered directly onto a PCB.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge ⁽¹⁾
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽²⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽³⁾
Machine Model
VALUE
±2000
±1000
±150
UNIT
V
(1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (V_S = VDD – GND)
Temperature
MIN
MAX
UNIT
1.8
5.5
V
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMP91200
PW (TSSOP)
UNIT
16 PINS
R_θJA
Junction-to-ambient thermal resistance
31
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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