LMH6657_16 Datasheet, PDF (4/35 Pages) Texas Instruments – 270-MHz Single Supply, Single and Dual Amplifiers

LMH6657, LMH6658
SNOSA35G – AUGUST 2002 – REVISED JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_IN Differential
Output Short Circuit Duration
Input Current
Supply Voltage (V⁺ - V^−)
Voltage at Input/Output pins
Soldering Information
Storage temperature, T_stg
Junction Temperature⁽⁴⁾
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
MIN
V^− − 0.8
–65
MAX
±2.5
See ^{(2) (3)}
±10
12.6
V⁺ + 0.8
260
260
100
150
UNIT
V
mA
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) Output short circuit duration is infinite for V_S < 6 V at room temperature and below. For V_S > 6 V, allowable short circuit duration is
1.5ms.
(4) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA . All numbers apply for packages soldered directly onto a PCB.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾
Machine Model⁽³⁾
VALUE
±2000
±200
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) Human body model, 1.5 kΩ in series with 100 pF.
(3) Machine Model, 0 Ω in series with 200 pF.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (V⁺ – V^−)
Operating Temperature⁽¹⁾
MIN
MAX
UNIT
3
12
V
−40
85
°C
(1) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA . All numbers apply for packages soldered directly onto a PCB.
6.4 Thermal Information
LMH6657
LMH6658
THERMAL METRIC⁽¹⁾
DBV (SOT-
23)
DCK (SC70)
D (SOIC)
DGK
(VSSOP)
UNIT
R_θJA
Junction-to-ambient thermal resistance⁽²⁾
5 PINS
265
478
8 PINS
190
235
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA . All numbers apply for packages soldered directly onto a PCB.
4
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