LMH0302 Datasheet, PDF (4/18 Pages) Texas Instruments – 3-Gbps HD/SD SDI Cable Driver

LMH0302
SNLS247H – APRIL 2007 – REVISED JUNE 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Input voltage (all inputs)
Output current
Lead temperature, soldering (4 s)
Junction temperature, T_J
Storage temperature, T_stg
MIN
MAX
UNIT
–0.5
3.6
V
–0.3
V_CC + 0.3
V
28
mA
260
°C
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
Machine model (MM)
VALUE
±4500
±2000
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V_CC – V_EE)
Operating junction temperature
Operating free air temperature, T_A
MIN
NOM
MAX UNIT
3.13
3.3
3.46
V
100
°C
–40
25
85
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH0302
RUM (WQFN)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
47.8
°C/W
47.2
°C/W
25.6
°C/W
1.7
°C/W
25.7
°C/W
14.5
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics – DC
Over supply voltage and operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
PARAMETER
TEST CONDITIONS
MIN
V_CMIN
V_SDI
Input common mode voltage
Input voltage swing
SDI, SDI
Differential, SDI, SDI
1.1 + V_SDI/2
100
TYP
MAX
V_CC – V_SDI/2
2200
UNIT
V
mV_P−P
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to V_EE = 0 V.
(2) Typical values are stated for V_CC = 3.3 V and T_A = 25°C.
4
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