LM3420 Datasheet, PDF (4/26 Pages) Texas Instruments – 8.4-V Li-Ion Battery Charge Controller

LM3420
SNVS116E – MAY 1998 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
Input voltage V_IN
Output current
Junction temperature
Lead temperature
Power dissipation (T_A = 25°C)⁽³⁾
Storage temperature, T_stg
Vapor phase (60 seconds)
Infrared (15 seconds)
MIN
MAX
UNIT
20
V
20
mA
150
215
°C
220
300
mV
−65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
R_θJA (junction-to-ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax − T_A)/R_θJA or the number given in the Absolute Maximum Ratings, whichever is lower. The typical thermal
resistance (R_θJA) when soldered to a printed circuit board is approximately 181.2°C/W for the DBV0005A package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
Ambient temperature
Junction temperature
Output current
MIN
NOM
MAX UNIT
−40
85
°C
−40
125
15
mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
R_θJA (junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax − T_A)/R_θJA or the number given in the Absolute Maximum Ratings, whichever is lower. The typical thermal
resistance (R_θJA) when soldered to a printed circuit board is approximately 181.2°C/W for the DBV0005A package.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LM3420
SOT-23 (DBV)
UNIT
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
181.2
91.2
38.2
5.3
37.7
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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