ISO7310-Q1_16 Datasheet, PDF (4/27 Pages) Texas Instruments – Robust EMC, Low Power, Single Channel Digital Isolator

ISO7310-Q1
SLLSER6 – DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage⁽²⁾
Voltage ⁽²⁾
I_O
Output current
T_J
Junction temperature
T_stg
Storage temperature
V_CC1 , V_CC2
IN, OUT
MIN
–0.5
–0.5
–65
MAX
6
V_CC+0.5 ⁽³⁾
±15
150
150
UNIT
V
V
mA
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±4000
±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
MIN
V_CC1, V_CC2 Supply voltage
3
I_OH
High-level output current
–4
I_OL
Low-level output current
V_IH
High-level input voltage
2
V_IL
Low-level input voltage
0
t_ui
Input pulse duration
40
1 / t_ui
Signaling rate
0
T_J
Junction temperature⁽¹⁾
T_A
Ambient temperature
–40
(1) To maintain the recommended operating conditions for T_J, see the Thermal Information table.
NOM
25
MAX
5.5
4
5.5
0.8
25
136
125
UNIT
V
mA
mA
V
V
ns
Mbps
°C
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
ISO7310-Q1
D (SOIC)
UNIT
8 PINS
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
119.9
65.2
61.3
19.3
60.7
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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