DS1776QML Datasheet, PDF (4/16 Pages) Texas Instruments – Pi-Bus Transceiver

DS1776QML
SNOSC82B – AUGUST 2012 – REVISED JUNE 2015
www.ti.com
5 Specifications
5.1 Absolute Maximum Ratings⁽¹⁾
MIN
MAX
UNIT
Supply Voltage (V_CC)
V_X, V_OH Output Level Control Voltage (A Outputs)
OEBn, OEA, LE Input Voltage (V_I)
A0–A7, B0–B7 Input Voltage (V_I)
Input Current (I_I)
Voltage Applied to Output in High Output State (V_O)
A0–A7 Current Applied to Output in Low Output State (I_O)
B0–B7 Current Applied to Output in Low Output State (I_O)
Lead Temperature (Soldering 10 Sec.)
Power Dissipation ⁽²⁾
−0.5
7.0
V
−0.5
7.0
V
−0.5
7.0
V
−0.5
5.5
V
−40
5
mA
−0.5V
+V_CC
40
40
mA
200
200
mA
260
°C
740
mW
Storage temperature
T_stg
−65
+150
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (package junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax - T_A)/θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower.
5.2 ESD Ratings
MIN
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ^{(1) (2)}
500
MAX
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) C_Zap = 120 pF, R_Zap = 1500Ω
UNIT
V
5.3 Recommend Operating Conditions
Supply Voltage (V_CC)
Operating Temp. Range (T_A)
MIN
MAX
UNIT
4.5
5.5
V
−55
+125
°C
5.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
DS1776QML
FK0028A
28 PINS
+67.5
See MIL-STD-
1835
UNIT
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: DS1776QML
Copyright © 2012–2015, Texas Instruments Incorporated