DRV2511-Q1 Datasheet, PDF (4/25 Pages) Texas Instruments – DRV2511-Q1 8-A Automotive Haptic Driver for Solenoids and Voice Coils

DRV2511-Q1
SLOS916A – JUNE 2016 – REVISED JULY 2016
PIN
NAME
NO.
OUT+
27, 29
Thermal Pad or
PowerPAD™
Pin Functions (continued)
TYPE
O
G
DESCRIPTION
Positive output.
Connect to GND for best system performance. If not connected to GND, leave floating.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
MIN
MAX
UNIT
Supply voltage
PVDD, AVDD
–0.3
30
V
IN+, IN-
–0.3
6.3
Input voltage, V_I
GAIN
EN
–0.3
VREG + 0.3
V
–0.3
PVDD + 0.3
Current
DC current on PVDD, GND, OUT+, OUT-
–8
8
A
Operating free-air temperature, T_A
Storage temperature range, T_stg
–40
125
°C
–50
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
MIN
–2000
–450
MAX
2000
450
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD
V_IH
V_IL
V_OL
I_IH
R_L
L_o
Supply voltage. PVDD, AVDD.
High-level input voltage. STDBY, EN, FS0, FS1, FS2.
Low-level input voltage. STDBY, EN, FS0, FS1, FS2.
Low-level output voltage. INTZ, R_PULL-UP = 100 kΩ, PVDD = 26 V.
High-level input current. STDBY, EN, FS0, FS1, FS2. (V_I = 2 V,
PVDD = 26 V).
Minimum load Impedance.
Output-filter Inductance.
MIN
NOM
MAX
4.5
26
2
0.8
0.8
50
1.65
1
UNIT
V
UNIT
V
V
V
V
µA
Ω
µH
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
DRV2511-Q1
DAP
32 PINS
32.4
17.2
UNIT
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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