DRV10866_15 Datasheet, PDF (4/22 Pages) Texas Instruments – 5V, 3Phase, Sensorless BLDC Motor Driver

DRV10866
SBVS206A – NOVEMBER 2012 – REVISED MARCH 2015
6 Specifications
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6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted).⁽¹⁾
Input voltage⁽²⁾
Output voltage⁽²⁾
Temperature
VCC
CS, FGS, PWM
GND
COM
U, V, W
FG
Operating junction temperature, T_J
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6.0
V
–0.3
6.0
V
–0.3
0.3
V
–1.0
6.0
V
–1.0
7.0
V
–0.3
6.0
V
–40
125
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal unless otherwise noted.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted).
Supply voltage
VCC
U, V, W
Voltage range
FG, CS, FGS, COM
GND
PWM
Operating junction temperature, T_J
MIN
MAX
UNIT
1.65
5.5
V
–0.7
6.5
V
–0.1
5.5
V
–0.1
0.1
V
–0.1
5.5
V
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV10866
DSC (WSON)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
42.3
44.5
17.1
°C/W
0.3
17.3
4.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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