DAC80004 Datasheet, PDF (4/38 Pages) Texas Instruments – Quad 16-,14-,12-Bit, 1 LSB INL, Buffered, Voltage-Output Digital-to-Analog Converters

DAC80004, DAC70004, DAC60004
SLASED6B – APRIL 2016 – REVISED JUNE 2016
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Voltage, VDD to GND
Voltage, digital input or output to GND
Voltage, analog input (REFIN) or output (V_OUTx) to GND
Input current to any pin except supply pins
Maximum junction temperature
Storage temperature range, T_stg
MIN
MAX
UNIT
–0.3
7
V
–0.3
V_DD + 0.3
V
–0.3
V_DD + 0.3
V
–10
10
mA
150
°C
-60
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Voltage, VDD to GND
Voltage, analog input (REFIN) or output
(V_OUTx) to GND
Ambient Operating Temperature, T_A
2.7 V ≤ V_DD ≤ 4.5 V
4.5 V ≤ V_DD ≤ 5.5 V
MIN
NOM
MAX UNIT
2.7
5.5
V
2.2
V_DD – 0.2
V
2.2
V_DD
V
-40
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
DACx0004
DMD (VSON) PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
39.6
99.1
°C/W
27.3
23.4
°C/W
9.0
42.8
°C/W
0.3
0.9
°C/W
8.9
42.0
°C/W
6.5
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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Product Folder Links: DAC80004 DAC70004 DAC60004