DAC121S101_15 Datasheet, PDF (4/37 Pages) Texas Instruments – 12-Bit Micro Power, RRO Digital-to-Analog Converter

DAC121S101, DAC121S101-Q1
SNAS265J – JUNE 2005 – REVISED SEPTEMBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
Supply Voltage, V_A
Voltage on any Input Pin
Input Current at Any Pin ⁽³⁾
Package Input Current ⁽³⁾
Power Consumption at T_A = 25°C
Soldering Temperature, Infrared, 10 Seconds⁽⁵⁾
Storage Temperature, T_stg
MIN
MAX
6.5
−0.3
(V_A + 0.3)
10
20
See ⁽⁴⁾
235
−65
150
UNIT
V
V
mA
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured with respect to GND = 0 V, unless otherwise specified
(3) When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than V_A), the current at that pin must
be limited to 10 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of 10 mA to two.
(4) The absolute maximum junction temperature (T_JMAX) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_JMAX, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature (T_A), and can be calculated using the formula
P_DMAX = (T_JMAX − T_A) / θ_JA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions must always be avoided.
(5) See the section entitled "Surface Mount" found in any post 1986 National Semiconductor Linear Data Book for methods of soldering
surface mount devices.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Machine Model
VALUE
±2500
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
4
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