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TMS370C722FNA Datasheet, PDF (35/61 Pages) Texas Instruments – 8-BIT MICROCONTROLLER
TMS370Cx2x
8-BIT MICROCONTROLLER
SPNS018C – FEBRUARY 1993 – REVISED FEBRUARY 1997
development system support
The TMS370 family development support tools include an assembler, a C compiler, a linker, an in-circuit
emulator XDS/22, CDT, and an EEPROM / UVEPROM programmer.
D Assembler/ linker (Part No. TMDS3740850–02 for PC)
– Includes extensive macro capability
– Provides high-speed operation
– Includes format conversion utilities for popular formats
D ANSI C Compiler (Part No. TMDS3740855–02 for PC, Part No. TMDS3740555–09 for HP700™, Sun-3™
or Sun-4™)
– Generates assembly code for the TMS370 that can be inspected easily
– Improves code execution speed and reduces code size with optional optimizer pass
– Enables direct reference the TMS370’s port registers by using a naming convention
– Provides flexibility in specifying the storage for data objects
– Interfaces C functions and assembly functions easily
– Includes assembler and linker
D CDT370 (Compact Development Tool) real-time in-circuit emulation
– Base (Part Number EDSCDT370 – for PC, requires cable)
– Cable for 40-pin DIP (Part No. EDSTRG40DILX)
– Cable for 44-pin PLCC (Part No. EDSTRG44PLCCX)
– Cable for 40-pin SDIP (Part No. EDSTRG40SDILX)
– EEPROM and EPROM programming support
– Allows inspection and modification of memory locations
– Includes compatibility to upload / download program and data memory
– Executes programs and software routines
– Includes 1 024 samples trace buffer
– Includes single-step executable instructions
– Uses software breakpoints to halt program execution at selected address
D XDS/22 in-circuit emulator
– Base (Part Number TMDS3762210 for PC, requires cable)
– Cable for 40-pin DIP / SDIP, 44-pin PLCC (Part No. TMDS3788844)
– Contains all of the features of the CDT370 described previously but does not have the capability to
program the data EEPROM and program EPROM
– Contains sophisticated breakpoint trace and timing hardware that provides up to 2 047 qualified trace
samples with symbolic disassembly
– Allows qualification of breakpoints by address and / or data on any type of memory acquisition. Up to four
levels of events can be combined to cause a breakpoint.
HP700 is a trademark of Hewlett-Packard Company.
Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.
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