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TMS370C722FNA Datasheet, PDF (35/61 Pages) Texas Instruments – 8-BIT MICROCONTROLLER | |||
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TMS370Cx2x
8-BIT MICROCONTROLLER
SPNS018C â FEBRUARY 1993 â REVISED FEBRUARY 1997
development system support
The TMS370 family development support tools include an assembler, a C compiler, a linker, an in-circuit
emulator XDS/22, CDT, and an EEPROM / UVEPROM programmer.
D Assembler/ linker (Part No. TMDS3740850â02 for PC)
â Includes extensive macro capability
â Provides high-speed operation
â Includes format conversion utilities for popular formats
D ANSI C Compiler (Part No. TMDS3740855â02 for PC, Part No. TMDS3740555â09 for HP700â¢, Sun-3â¢
or Sun-4â¢)
â Generates assembly code for the TMS370 that can be inspected easily
â Improves code execution speed and reduces code size with optional optimizer pass
â Enables direct reference the TMS370âs port registers by using a naming convention
â Provides flexibility in specifying the storage for data objects
â Interfaces C functions and assembly functions easily
â Includes assembler and linker
D CDT370 (Compact Development Tool) real-time in-circuit emulation
â Base (Part Number EDSCDT370 â for PC, requires cable)
â Cable for 40-pin DIP (Part No. EDSTRG40DILX)
â Cable for 44-pin PLCC (Part No. EDSTRG44PLCCX)
â Cable for 40-pin SDIP (Part No. EDSTRG40SDILX)
â EEPROM and EPROM programming support
â Allows inspection and modification of memory locations
â Includes compatibility to upload / download program and data memory
â Executes programs and software routines
â Includes 1 024 samples trace buffer
â Includes single-step executable instructions
â Uses software breakpoints to halt program execution at selected address
D XDS/22 in-circuit emulator
â Base (Part Number TMDS3762210 for PC, requires cable)
â Cable for 40-pin DIP / SDIP, 44-pin PLCC (Part No. TMDS3788844)
â Contains all of the features of the CDT370 described previously but does not have the capability to
program the data EEPROM and program EPROM
â Contains sophisticated breakpoint trace and timing hardware that provides up to 2 047 qualified trace
samples with symbolic disassembly
â Allows qualification of breakpoints by address and / or data on any type of memory acquisition. Up to four
levels of events can be combined to cause a breakpoint.
HP700 is a trademark of Hewlett-Packard Company.
Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.
⢠POST OFFICE BOX 1443 HOUSTON, TEXAS 77251â1443
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