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TSC2000_13 Datasheet, PDF (33/38 Pages) Texas Instruments – PDA ANALOG INTERFACE CIRCUIT
In the previous example, when the D/A converter current is
zero, the voltage on the AOUT pin will rise above the TSC2000
supply voltage. This is not a problem, however, since V+ was
within the absolute maximum ratings of the TSC2000, so no
special precautions are necessary. Many LCD displays re-
quire voltages much higher than the absolute maximum
ratings of the TSC2000. In this case, the addition of an NPN
transistor, as shown in Figure 29, will protect the AOUT pin
from damage.
V+
R1
R2
VSUPPLY
VBIAS
8 Bits
D/A Converter
AOUT
ARNG
RRNG
FIGURE 29. D/A Converter Circuit when Using V+ Higher
than VSUPPLY.
LAYOUT
The following layout suggestions should provide optimum
performance from the TSC2000. However, many portable
applications have conflicting requirements concerning power,
cost, size, and weight. In general, most portable devices
have fairly “clean” power and grounds because most of the
internal components are very low power. This situation would
mean less bypassing for the converter’s power and less
concern regarding grounding. Still, each situation is unique
and the following suggestions should be reviewed carefully.
For optimum performance, care should be taken with the
physical layout of the TSC2000 circuitry. The basic SAR
architecture is sensitive to glitches or sudden changes on the
power supply, reference, ground connections, and digital
inputs that occur just prior to latching the output of the analog
comparator. Therefore, during any single conversion for an
‘n-bit’ SAR converter, there are n ‘windows’ in which large
external transient voltages can easily affect the conversion
result. Such glitches might originate from switching power
supplies, nearby digital logic, and high power devices. The
degree of error in the digital output depends on the reference
voltage, layout, and the exact timing of the external event.
The error can change if the external event changes in time
with respect to the SCL input.
With this in mind, power to the TSC2000 should be clean and
well bypassed. A 0.1µF ceramic bypass capacitor should be
placed as close to the device as possible. A 1µF to 10µF
capacitor may also be needed if the impedance of the
connection between +VDD and the power supply is HIGH.
A bypass capacitor is generally not needed on the reference
pin because the reference is buffered by an internal op amp.
If an external reference voltage originates from an op amp,
make sure that it can drive any bypass capacitor that is used
without oscillation.
The TSC2000 architecture offers no inherent rejection of
noise or voltage variation in regards to using an external
reference input. This is of particular concern when the
reference input is tied to the power supply. Any noise and
ripple from the supply will appear directly in the digital results.
While high frequency noise can be filtered out, voltage
variation due to line frequency (50Hz or 60Hz) can be difficult
to remove.
The GND pin should be connected to a clean ground point.
In many cases, this will be the “analog” ground. Avoid
connections which are too near the grounding point of a
microcontroller or digital signal processor. If needed, run a
ground trace directly from the converter to the power supply
entry or battery connection point. The ideal layout will include
an analog ground plane dedicated to the converter and
associated analog circuitry.
In the specific case of use with a resistive touch screen, care
should be taken with the connection between the converter
and the touch screen. Since resistive touch screens have
fairly low resistance, the interconnection should be as short
and robust as possible. Loose connections can be a source
of error when the contact resistance changes with flexing or
vibrations.
As indicated previously, noise can be a major source of error
in touch screen applications (e.g., applications that require a
back-lit LCD panel). This EMI noise can be coupled through
the LCD panel to the touch screen and cause “flickering” of
the converted data. Several things can be done to reduce
this error, such as utilizing a touch screen with a bottom-side
metal layer connected to ground. This will couple the majority
of noise to ground. Additionally, filtering capacitors, from Y+,
Y–, X+, and X– to ground, can also help. Note, however, that
the use of these capacitors will increase screen settling time
and require longer panel voltage stabilization times, as well
as increased precharge and sense times for the PENIRQ
circuitry of the TSC2000.
TSC2000
33
SBAS257
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