TLC227X-EP Datasheet, PDF (33/40 Pages) Texas Instruments – ADVANCED LINCMOS RAIL TO RAIL OPERATIONAL AMPLIFIERS

www.ti.com
PACKAGE MATERIALS INFORMATION
17-Feb-2016
*All dimensions are nominal
Device
TLC2272AMDREP
TLC2274AMDREP
TLC2274AMPWREP
TLC2274MDREP
Package Type
SOIC
SOIC
TSSOP
SOIC
Package Drawing Pins
D
8
D
14
PW
14
D
14
SPQ
2500
2500
2000
2500
Length (mm)
367.0
333.2
367.0
333.2
Width (mm)
367.0
345.9
367.0
345.9
Height (mm)
38.0
28.6
35.0
28.6
Pack Materials-Page 2