OPT8241 Datasheet, PDF (31/34 Pages) Texas Instruments – 3D Time-of-Flight Sensor

NBN0078A
SCALE 1.800
A
8.797
8.717
(0.0172)
PIXEL AREA CTR
BALL 1 CORNER
INDEX AREA
PACKAGE OUTLINE
COG - 0.745 mm max height
CHIP ON GLASS
B
(1.17945)
PIXEL AREA CTR
PIXEL AREA
7.899
7.819
(0.04)
(0.1)
DIE
(0.5)
0.745 MAX
0.213
0.187
TYP
SEE DETAIL A
BALL TYP
C
DETAIL A DETAILA
SCALE 14.000
SEATING PLANE
0.05 C
(0.06)
(0.19) TYP
(8.37) TYP
(5.95)
(0.194) TYP
M
L
K
J
H
G
(7.48)
TYP
F
E
D
C
DIE
PKG
(6.91)
NOTES:
44X (0.68)
B
A1 ₂
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
PKG
36X (0.465)
78X
0.285
0.235
4222085/A 06/2015
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
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