OPA2613_14 Datasheet, PDF (31/34 Pages) Texas Instruments – Dual, Wideband, High Output Current, Operational Amplifier with Current Limit

MECHANICAL DATA
DTJ (R-PDSO-G8)
MPDS100 – AUGUST 2001
PLASTIC SMALL–OUTLINE
–A– ^{0.1968 (4,98) C}
0.189 (4,80)
8
5
–B–
Index
Area
1
0.1574 (4,00) _D
0.1497 (3,80)
0.244 (6,20)
0.2284 (5,80)
0.010 (0,25) M B M
4
0.050 (1,27)
0.018 (0,46)
0.016 (0,41)
Base
Plane
Seating
Plane
0.020 (0,51)
G _{0.013 (0,33)}
0.010 (0,25) M C A M B S
0.0688 (1,75)
–C– _{0.0532 (1,35)}
0.004 (0,10)
0.001 (0,03)
0.004 (0,10)
0.0196 (0,50)
× 45°
0.0099 (0,25)
0.0098 (0,25)
0.0075 (0,20)
0.110 (2,79)
0.090 (2,29)
ø0.015 (0,38) M Z X S
0°–8°
0.150 (3,81)
0.130 (3,30)
Bottom View
Heat Sink
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body length dimension does not include mold flash,
protrusions or gate burrs. Mold flash, protrusions and
gate burrs shall not exceed 0.006 (0,15) per side.
D. Body width dimension does not include inter–lead
flash or protrusions. Inter–lead flash and protrusions
shall not exceed 0.010 (0,25) per side.
E. The chamfer on the body is optional. If it is not
present, a visual index feature must be located within
the cross-hatched area.
F. Lead dimension is the length of terminal for soldering
to a substrate.
0.050 (1,27)
F _{0.016 (0,41)}
4202635/A 08/01
G. The lead width, as measured 0.014 (0,36) or
greater above the seating plane, shall not exceed
a maximum value of 0.024 (0,61).
H. Lead-to-lead coplanarity shall be less than
0.004 (0,10) from Seating Plane.
I. Falls within JEDEC MS-012-AA.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1