TPS9111 Datasheet, PDF (3/23 Pages) Texas Instruments – CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY

TPS9111
CELLULAR SUBSCRIBER TERMINAL
POWER SUPPLY
SLVS134A – NOVEMBER 1996 – REVISED APRIL 1998
TPS9111Y chip information
These chips, when properly assembled, display characteristics similar to those of the TPS9111. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
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20 19
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94
1
2
16 _{CHIP THICKNESS:}
15 TYPICAL
BONDING PADS:
15 3.3 × 3.3 MINIMUM
TJ max = 150°C
14 ^{TOLERANCES ARE ± 10%.}
ALL DIMENSIONS
ARE IN MILS.
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3
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153
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9 10
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