TPS79801-Q1_17 Datasheet, PDF (3/25 Pages) Texas Instruments – 50 mA, 3 V to 50 V, Micropower, Low-Dropout Linear Regulator

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5 Pin Configuration and Functions
TPS79801-Q1, TPS79850-Q1
SLVS822E – MARCH 2009 – REVISED SEPTEMBER 2015
DGN Package
8-Pin MSOP With PowerPAD™
Top View
OUT
1
SENSE/FB
2
NC
3
GND
4
8
IN
7
NC
6
NC
5
EN
The exposed thermal pad is connected to ground through pin 4 (GND).
NAME
EN
PIN
NO.
5
IN
GND
OUT
SENSE/FB
NC
8
4
1
2
3, 6, 7
Pin Functions
I/O
DESCRIPTION
I
Enable pin. Driving the EN pin high turns on the regulator over full operating range. Driving this pin
low puts the regulator into shutdown mode over full operating range.
Input pin. TI recommends a 0.1-μF ceramic or greater capacitor from this pin to ground to assure
I
stability. Both input and output capacitor grounds should be tied back to the IC ground with no
significant impedance between them.
O Ground. The exposed thermal pad is connected to ground through this pin.
O
Regulated output voltage pin. A small (1 μF) capacitor is needed from this pin to ground to assure
stability.
I
This pin is the input to the control loop error amplifier; it is used to set the output voltage of the
device.
— No internal connection
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_IN Input voltage range
T_J Junction temperature range⁽³⁾
T_stg Storage temperature
IN ⁽²⁾
OUT
FB
EN ⁽²⁾
Enable to IN differential
MIN
MAX
UNIT
–65
60
V
–0.3
28
V
–0.3
7
V
–65
60
V
0.6
V_IN
V
–40
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transient: 500 ms for V_IN > 50 V
(3) The junction temperature must not exceed 125ºC. See Figure 1 to determine the maximum ambient operating temperature versus the
supply voltage and load current. The safe operating area curves assume a 50ºC/W thermal impedance and may need to be adjusted to
match actual system thermal performance.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011
VALUE
±2000
±1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
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