TPS62230_14 Datasheet, PDF (3/36 Pages) Texas Instruments – 2 MHz / 3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package

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TPS62230, TPS62231, TPS62232, TPS62233, TPS62234, TPS62235, TPS62236
TPS62237, TPS62238, TPS62239, TPS622310, TPS622311, TPS622312
TPS622313, TPS622314, TPS622315, TPS622316, TPS622317, TPS622318
SLVS941E – APRIL 2009 – REVISED DECEMBER 2010
DISSIPATION RATINGS⁽¹⁾
PACKAGE
1 × 1.5 SON
R_θJA
234°C/W ⁽²⁾
POWER RATING
FOR T_A ≤ 25°C
420 mW
DERATING FACTOR
ABOVE T_A = 25°C
4.2 mW/°C
(1) Maximum power dissipation is a function of T_J(max), θ_JA and T_A. The maximum allowable power dissipation at any allowable ambient
temperature is P_D = [T_J(max) – T_A] /_θJA.
(2) This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
RECOMMENDED OPERATING CONDITIONS
operating ambient temperature T_A = –40 to 85°C (unless otherwise noted)⁽¹⁾
Supply voltage V_IN ⁽²⁾
Effective inductance
MIN NOM MAX UNIT
2.05
6V
2.2
μH
Effective capacitance
Recommended minimum
supply voltage
V_OUT ≤ V_IN -1 V ⁽³⁾
V_OUT ≤ 1.8V
Operating virtual junction temperature range, T_J
500 mA maximum I_OUT ⁽⁴⁾
350mA maximum I_OUT ⁽⁵⁾
60 mA maximum output current⁽⁵⁾
2.0 4.7
μF
3.0 3.6
2.5 2.7 V
2.05
–40
125 °C
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A(max)) is dependent on the maximum operating junction temperature (T_J(max)), the
maximum power dissipation of the device in the application (P_D(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θ_JA), as given by the following equation: T_A(max) = T_J(max) – (θ_JA × P_D(max)).
(2) The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold.
(3) For a voltage difference between minimum V_IN and V_OUT of ≥ 1 V
(4) Typical value applies for T_A = 25°C, maximum value applies for T_A = 70°C with T_J ≤ 125°C, PCB layout needs to support proper thermal
performance.
(5) Typical value applies for T_A = 25°C, maximum value applies for T_A = 85°C with T_J ≤ 125°C, PCB layout needs to support proper thermal
performance.
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