TPS2811_13 Datasheet, PDF (3/38 Pages) Texas Instruments – DUAL HIGH-SPEED MOSFET DRIBERS

TPS2811, TPS2812, TPS2813, TPS2814, TPS2815
DUAL HIGHĆSPEED MOSFET DRIVERS
SLVS132F − NOVEMBER 1995 − REVISED OCTOBER 2004
TPS28xxY chip information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(8)
(2)
57
(3)
(4)
47
(1)
REG_IN
(2)
1IN
(4)
2IN
TPS2811Y
TPS2812Y
TPS2813Y
(8)
REG_OUT
(7)
1OUT
(6)
VCC
(5)
2OUT
(7)
(3)
GND
(1)
1IN1
(2)
1IN2
(3)
2IN1
(4)
2IN2
TPS2814Y
(7)
1OUT
(6)
VCC
(5)
2OUT
(8)
(6)
GND
(1)
1IN1
(2)
(7)
1OUT
1IN2
(6)
(3)
TPS2815Y
VCC
2IN1
(4)
(5)
2IN2
(5)
2OUT
(8)
GND
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax OPERATING TEMPERATURE = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
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