TLE2141M Datasheet, PDF (3/21 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

TLE2141M, TLE2141AM
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SGLS059 – NOVEMBER 1990 – REVISED OCTOBER 1991
chip information
These chips, when properly assembled, display characteristics similar to the TLE2141M. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
OFFSET N1
IN +
IN –
OFFSET N2
(1) ^VCC+
(7)
(3)
+
(2)
–
(5)
(4)
VCC _–
(6)
OUT
64
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS
65
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