TLC556IDG4 Datasheet, PDF (3/22 Pages) Texas Instruments – DUAL LinCMOSE TIMERS

TLC556, TLC556Y
DUAL LinCMOS™ TIMERS
SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
TLC556Y chip information
These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted
with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJ max = 150°C
61
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS
NO BACKSIDE METALLIZATION
PIN (7) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
97
FUNCTIONAL BLOCK DIAGRAM (EACH TIMER)
CONT
VDD ₍₃₎
(14)
RESET
(4)
R
(2)
THRESH
R
R1
R1
S
(6)
TRIG
R
(7)
GND
(5)
OUT
(1)
DISCH
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