TL1454CPW Datasheet, PDF (3/25 Pages) Texas Instruments – DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM) CONTROL CIRCUIT

TL1454, TL1454Y
DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM)
CONTROL CIRCUIT
SLVS086B – APRIL 1995 – REVISED NOVEMBER 1997
TL1454Y chip information
This chip, when properly assembled, displays characteristics similar to the TL1454C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(15)
(14)
(13) (12)
(11)
(10)
(9)
(16)
86
(1)
(8)
(2)
(3)
(4) (5)
(6)
(7)
108
CT ⁽¹⁾
(2)
RT
(3)
DTC1
(4)
IN1 +
(5)
IN1–
COMP1 ⁽⁶⁾
(7)
GND
(8)
OUT1
TL1454Y
(16) _REF
(15)
SCP
(14)
DTC2
(13)
IN2+
(12)
IN2 –
(11) _COMP2
(10)
VCC
(9)
OUT2
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
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