MSP430G2252-DIE Datasheet, PDF (3/5 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430G2252-DIE
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Table 1. Bond Pad Coordinates in Microns⁽¹⁾
DESCRIPTION
DVCC
P1.0/TA0CLK/ACLK/A0/CA0
P1.1/TA0.0/A1/CA1
P1.2/TA0.1/A2/CA2
P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/CA4/TCK
P1.5/TA0.0/SCLK/A5/CA5/TMS
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK
P1.7/SDI/SDA/CAOUT/A7/CA7/TDO/TDI
RST BAR/NMI/SBWTDIO
TEST/SBWTCK
XOUT/P2.7
XIN/P2.6/TA0.1
DVSS
DVSS
DVCC
PAD NUMBER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
X MIN
244
87.4
87.4
87.4
87.4
87.4
240.15
650.15
820.15
976.15
1130.15
1610.15
1800.15
2204.85
2362.6
2362.6
2362.6
2362.6
2362.6
1994.8
1859.8
404
Y MIN
2253.65
2050.15
1810.15
1650.15
630.15
260.15
87.4
87.4
87.4
87.4
87.4
87.4
87.4
87.4
260.15
710.15
1254.8
1583.85
2096.15
2253.65
2253.65
2253.65
(1) Substrate is floating.
SLAS853 – APRIL 2012
X MAX
319
162.4
162.4
162.4
162.4
162.4
315.15
725.15
895.15
1051.15
1205.15
1685.15
1875.15
2279.85
2437.6
2437.6
2437.6
2437.6
2437.6
2069.8
1934.8
479
Y MAX
2328.65
2125.15
1885.15
1725.15
705.15
335.15
162.4
162.4
162.4
162.4
162.4
162.4
162.4
162.4
335.15
785.15
1329.8
1658.85
2171.15
2328.65
2328.65
2328.65
Copyright © 2012, Texas Instruments Incorporated
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