LP3991_14 Datasheet, PDF (3/20 Pages) Texas Instruments – 300mA Linear Voltage Regulator for Digital Applications

LP3991
www.ti.com
SNVS296G – DECEMBER 2006 – REVISED JANUARY 2011
Absolute Maximum Ratings ^{(1) (2)}
V_IN, V_OUT, Pins: Voltage to GND
V_EN Pin: Voltage to GND
Junction Temperature
Lead/Pad Temp. ⁽³⁾
Micro SMD
Storage Temperature
Continuous Power Dissipation
(4)
ESD ⁽⁵⁾
Human Body Model
Machine Model
-0.3 to 6.5V
-0.3 to (V_IN + 0.3V) to 6.5V (max)
150°C
260°C
-65 to 150°C
Internally Limited
2KV
200V
(1) All Voltages are with respect to the potential at the GND pin.
(2) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
(3) For further information on these packages please refer to the following application notes,AN-1112 Micro SMD Wafer Level Chip Scale
Package.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
(5) The human body model is 100pF discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings ⁽¹⁾
Input Voltage Range
Recommended Load Current
Junction Temperature
Ambient Temperature T_ARange
(2)
1.65 to 4.0V
300mA
-40°C to 125°C
-40°C to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
(2) The maximum ambient temperature (T_A(max)) is dependant on the maximum operating junction temperature (T_J(max-op) = 125°C), the
maximum power dissipation of the device in the application (P_D(max)), and the junction to ambient thermal resistance of the part /
package in the application (θ_JA), as given by the following equation: T_A(max) = T_J(max-op) - (θ_JA × P_D(max)).
Thermal Properties ⁽¹⁾
Junction To Ambient Thermal Resistance⁽²⁾
θ_JA JEDEC Board
(3)
88°C/W
θ_JA 4 Layer Board
160°C/W
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated
test conditions, see the Electrical Characteristics tables.
(2) Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
(3) Full details can be found in JESD61-7
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