LP2987 Datasheet, PDF (3/30 Pages) National Semiconductor (TI) – Micropower, 200 mA Ultra Low-Dropout Voltage Regulator with Programmable Power-On Reset Delay; Low Noise Version Available (LP2988)

LP2987, LP2988
www.ti.com
SNVS004J – MARCH 1999 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Storage Temperature Range
Operating Junction
Temperature Range
Lead Temperature
(Soldering, 5 seconds)
ESD Rating ⁽³⁾
Power Dissipation ⁽⁴⁾
Input Supply Voltage
(Survival)
Input Supply Voltage
(Operating)
Shutdown Pin
Sense Pin
Output Voltage
(Survival) ⁽⁵⁾
I_OUT (Survival)
Input-Output Voltage
(Survival) ⁽⁶⁾
−65°C to +150°C
−40°C to +125°C
260°C
2 kV
Internally Limited
−0.3V to +16V
2.1V to +16V
−0.3V to +16V
−0.3V to +6V
−0.3V to +16V
Short Circuit Protected
−0.3V to +16V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The ESD rating of the Bypass pin is 500V (LP2988 only). The ESD rating of the V_IN pin is 1kV and the Delay pin is ESD rated at 1.5kV.
(4) The maximum allowable power dissipation is a function of the maximum junction temperature, T_J(MAX), the junction-to-ambient thermal
resistance, θ_J−A, and the ambient temperature, T_A. The maximum allowable power dissipation at any ambient temperature is calculated
using:
The value of θ_J−A for the SOIC-8 (D) package is 160°C/W, and the VSSOP-8 (DGK) package is 200°C/W.
The value θ_J−A for the WSON (NGN) package is specifically dependent on PCB trace area, trace material, and the number of layers and
thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187
(literature number SNOA401). Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown.
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the LM2987/8 output must be diode-clamped
to ground.
(6) The output PNP structure contains a diode between the V_IN and V_OUT terminals that is normally reverse-biased. Forcing the output
above the input will turn on this diode and may induce a latch-up mode which can damage the part (see APPLICATION HINTS).
ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for T_J = 25°C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V_IN = V_O(NOM) + 1V, I_L = 1 mA, C_OUT = 4.7 µF, C_IN = 2.2 µF, V_S/D = 2V.
Symbol
Parameter
Conditions
LM2987/8AI-X.X ⁽¹⁾ LM2987/8I-X.X ⁽¹⁾
Typical
Min
Max
Min
Max
Units
ΔV_O
Output Voltage Tolerance
0.1 mA < I_L < 200 mA
−0.5
0.5
−1.0
1.0
−0.8
0.8
−1.6
1.6
%V_NOM
−1.8
1.8
−2.8
2.8
ΔV_O/ΔV_IN
Output Voltage Line
Regulation
V_O(NOM) + 1V ≤ V_IN ≤ 16V _0.007
0.014
0.032
0.014
%/V
0.032
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
Copyright © 1999–2013, Texas Instruments Incorporated
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