LP2986 Datasheet, PDF (3/33 Pages) National Semiconductor (TI) – Micropower, 200 mA Ultra Low-Dropout Fixed or Adjustable Voltage Regulator

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5 Pin Configuration and Function
D Package
8-Pin SOIC
Top View
1 ^GROUND
8 SHUTDOWN
2 ^FEEDBACK
7 ERROR
TAP 3
6 SENSE
IN 4
5 OUT
LP2986
SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015
GROUND ₁
FEEDBACK 2
TAP 3
IN ₄
DGK Package
8-Pin VSSOP
Top View
8 SHUTDOWN
7 _ERROR
6 SENSE
5 OUT
See WSON Mounting.
NAME
PIN
NO.
ERROR
7
FEEDBACK
2
GROUND
1
IN
4
OUT
5
SENSE
6
SHUTDOWN
8
TAP
3
DAP (Thermal Pad -
WSON only)
√
NGN Package
8-Pin WSON
Top View
GROUND 1
FEEDBACK 2
TAP 3
IN 4
Exposed Pad
on Bottom
(DAP)
8 _SHUTDOWN
7 _ERROR
6 SENSE
5 _OUT
Pin Functions: All Packages
I/O
DESCRIPTION
O
Active-low open-collector error output. Goes low when V_OUT drops by 5% of its
nominal value.
Determines the output voltage. Connect to TAP (with OUT tied to SENSE) to output
I
the fixed voltage corresponding to the part version, or connect to a resistor divider to
adjust the output voltage (see Typical Applications).
—
Ground.
I
Input voltage supply.
O
Regulated output.
I
Connect to OUT (with FEEDBACK tied to TAP) to output the voltage corresponding to
the part version (see Typical Applications).
I
Active-high. pull low to showdown the output voltage.
Middle tap of the Internal voltage divider. Tie to FEEDBACK (with OUT tied to
O
SENSE) to output the fixed voltage corresponding to the part version (see Typical
Applications).
The exposed thermal pad on the bottom of the WSON package should be connected
to a copper thermal pad on the PCB under the package. The use of thermal vias to
remove heat from the package into the PCB is recommended. Connect the thermal
—
pad to ground potential or leave floating. Do not connect the thermal pad to any
potential other than the same ground potential seen at device pin 1. For additional
information on using TI's non-pullback WSON package, see Application Note AN-
1187 Leadless Leadframe Package (LLP) (SNOA401).
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