LM36273 Datasheet, PDF (3/9 Pages) Texas Instruments – Integrated Backlight Driver With Integrated LCD Bias

www.ti.com
5 Device and Documentation Support
LM36273
SNVSA80A – FEBRUARY 2016 – REVISED FEBRUARY 2016
5.1 Device Support
5.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.1.2 Development Support
Power Stage Designer™ tools can be used for the boost calculation: http://www.ti.com/tool/powerstage-designer
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation, see the following:
• AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)
• Understanding Boost Power Stages in Switch Mode Power Supplies
http://focus.ti.com/lit/an/slva061/slva061.pdf
5.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LM36273
Submit Documentation Feedback
3