LM3407 Datasheet, PDF (3/22 Pages) National Semiconductor (TI) – 350 mA, Constant Current Output Floating Buck Switching Converter for High Power LEDs

LM3407
www.ti.com
SNVS553B – JANUARY 2008 – REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for
availability and specifications.
VALUE / UNIT
VIN to GND
-0.3V to 36V
VIN to GND (Transient)
42V (500 ms)
LX to GND
-0.3V to 36V
LX to GND (Transient)
-3V (2 ns), 42V (500
ms)
ISNS, FS, DIM, EN to GND
ESD Rating Human Body Model ⁽²⁾
-0.3V to 7V
2kV
Junction Temperature
150°C
Storage Temperature
−65°C to + 125°C
Soldering Information
Lead Temperature (Soldering, 10sec)
260°C
Infrared or Convection (20sec)
235°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.
(2) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
RECOMMENDED OPERATING CONDITIONS
VALUE / UNIT
V_IN
Junction Temperature Range
Thermal Resistance (θ_JA) ⁽¹⁾
4.5V to 30V
−40°C to + 125°C
50°C/W
(1) θ_JA of 50°C/W with thermal pad, EP soldered to a minimum of 2 square inches of 1 oz. Copper on the top or bottom PCB layer.
Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LM3407
Submit Documentation Feedback
3