CD74HC4051-EP Datasheet, PDF (3/15 Pages) Texas Instruments – ANALOG MULTIPLEXER/DEMULTIPLEXER

CD74HC4051-EP
ANALOG MULTIPLEXER/DEMULTIPLEXER
SCLS464 – SEPTEMBER 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)^†
Supply voltage range, V_CC – V_EE (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 10.5 V
Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Supply voltage range, V_EE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.5 V to –7 V
Input clamp current, I_IK (V_I < –0.5 V or V_I > V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, I_OK (V_O < V_EE – 0.5 V or V_O > V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Switch current (V_I > V_EE – 0.5 V or V_I < V_CC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
V_EE current, I_EE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Package thermal impedance, θ_JA (see Note 2): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages referenced to GND unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN MAX UNIT
VCC Supply voltage (see Note 4)
2
6V
Supply voltage, VCC – VEE (see Figure 1)
2
10 V
VEE Supply voltage, (see Note 4 and Figure 2)
0
–6 V
VCC = 2 V
1.5
VIH High-level input voltage
VCC = 4.5 V
3.15
V
VCC = 6 V
4.2
VCC = 2 V
0.5
VIL Low-level input voltage
VCC = 4.5 V
1.35 V
VCC = 6 V
1.8
VI Input control voltage
0 VCC V
VIS Analog switch I/O voltage
VEE VCC V
VCC = 2 V
0 1000
tt
Input transition (rise and fall) time
VCC = 4.5 V
0 500 ns
VCC = 6 V
0 400
TA Operating free-air temperature
–55 125 °C
NOTES:
3. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4. In certain applications, the external load resistor current may include both VCC and signal-line components. To avoid drawing VCC
current when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed
0.6 V (calculated from ron values shown in electrical characteristics table). No VCC current flows through RL if the switch current flows
into the COM OUT/IN A terminal.
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