CD4066B-Q1 Datasheet, PDF (3/15 Pages) Texas Instruments – CMOS QUAD BILATERAL SWITCH

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CD4066B-Q1
SCHS383 – APRIL 2011
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
VALUE
UNIT
DC supply-voltage range, V_DD (voltages referenced to V_SS terminal)
Input voltage range, V_is (all inputs)
DC input current, IIN (any one input)
Package thermal impedance, θ_JA ⁽²⁾
D package
Human-Body Model (HBM)
ESD Electrostatic discharge⁽³⁾
Machine Model (MM)
–0.5 to 20
–0.5 to V_DD + 0.5
±10
86
500
150
V
V
mA
°C/W
V
Field_Induced_Charged Device Model (CDM)
1000
Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max
265
°C
Storage temperature range, T_stg
–65 to 150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
(3) Tested in accordance with AEC-Q100.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
CD4066B-Q1
D PACKAGE
UNITS
14 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
92.4
52.5
46.7
°C/W
46.4
46.4
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
V_DD
Supply voltage
T_A
Operating free-air temperature
MIN MAX UNIT
3
18 V
–40
125 °C
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