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BQ24200DGNG4 Datasheet, PDF (3/20 Pages) Texas Instruments – SINGLE-CHIP LI-ION AND LI-POL CHARGE MANAGEMENT IC FOR CURRENT-LIMITED APPLICATIONS
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bq24200, bq24201
bq24202, bq24203
bq24204, bq24205
SLUS501C – OCTOBER 2001 – REVISED MARCH 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
Supply voltage (Vcc with respect to GND)
Input voltage, IN, STAT, TS (all with respect to GND)
Input voltage, BAT, OUT (all with respect to GND)
Output sink/source current (STAT)
Tstg
Storage temperature range
TJ
Junction temperature range
Lead temperature (soldering, 10 sec)
VALUE
16.5
16.5
7
15
–65 to 150
–40 to 125
300
UNIT
V
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE
8 Pin DGN(1)
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT (θJA)
57.20°C/W
THERMAL IMPEDANCE
JUNCTION-TO-CASE (θJC)
4.4°C/W
TA ≤ 25°C
POWER RATING
1.75 W
DERATING FACTOR
ABOVE TA = 25°C
0.017 W/°C
(1) This data is based on using JEDEC High-K board and topside traces, top and bottom thermal pad (2 mm × 3 mm), internal 1 oz. power
and ground planes, four thermal via underneath the die connecting to ground plane.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
VIN
Input voltage
TJ
Operating junction temperature range
MIN
V(LOWV-MIN)
V(LOWV-MIN)
–40
MAX
13.5
13.5
125
UNIT
V
°C
ELECTRICAL CHARACTERISTICS
over 0°C ≤ TJ ≤ 125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ICC(VCC) Vcc Current
ICC(SLP) Sleep current
ICC(STDBY
)
IIB(BAT)
IIB(TB)
Standby current
Input bias current on BAT pin
Input bias current on TS pin
Vcc > Vcc(min)
Sum of currents into OUT and BAT pins, Vcc <
V(SLP), 0°C ≤ TJ ≤ 85°C
Sum of currents into OUT and BAT pins, Vcc <
V(SLP)
Sum of currents into Vcc, IN and TS pins,
(Vcc–VI(TS)) ≤ 300 mV
0.1 × Vcc ≤ VI(TS) ≤ 0.8 × Vcc
MIN TYP MAX UNIT
1.7 2.5 mA
5 µA
10 µA
1 mA
1 µA
1 µA
VOLTAGE REGULATION
VO(REG) + V(DO.MAX) ≤ VCC, I(TERM) < IO(OUT) ≤500 mA, over 0°C ≤ TJ ≤125°C and supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
VO(REG) Output voltage
VO(REG) + V(DO–MAX) ≤ 10 V, I(TERM) < IO(OUT) ≤ 250 mA
VO(REG) + V(DO–MAX) ≤ 10 V, I(TERM) < IO(OUT) ≤ 250 mA
4.0795 4.10 4.1205 V
4.05 4.10 4.15 V
4.1790 4.20 4.2210 V
4.15 4.20 4.25 V
V(DO)
Dropout voltage (V(IN) – V(OUT)) VO(REG) + V(DO–MAX) ≤ Vcc, IO(OUT) = 500 mA
200 350
500 mV
Copyright © 2001–2008, Texas Instruments Incorporated
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